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Silicon structures with dielectric isolation, silicon-on-insulator structures, and III-N compounds on silicon (AlN/Si, GaN/Si, etc.) are most commonly used in power electronics. One of the problems in such structures manufacturing is the complex deformation (bow or warp) of structures due to the use of a relatively thick layer of polysilicon as a support structure for monocrystalline silicon areas. In this work, the dependences of the mechanical properties of polycrystalline silicon layers on the growth temperature during their deposition by chemical gas transport are studied. The dependencies of polysilicon properties on the composition and ratio of gas reagents during the deposition process were demonstrated. For chloride and bromide atmospheres, the optimum operating temperature ranges and the working ratio of chlorine and bromine in a gas environment have been established. It was found that the main technological parameter determining the magnitude and direction of the bow of silicon structures is the growth temperature of the polysilicon layer. The results of trench filling in dielectric isolation structures during the support layer formation are given. The obtained results have a practical bearing on the technology of semiconductor devices creation for power electronics.
Dmitry V. Tarasov
Epiel JSC, Russia, 124460, Moscow, Zelenograd, Academician Valiev st., 6, bld. 2; National Research University of Electronic Technology, Russia, 124498, Moscow, Zelenograd, Shokin sq., 1
Evgeniy M. Sokolov
Epiel JSC, Russia, 124460, Moscow, Zelenograd, Academician Valiev st., 6, bld. 2
Sergey A. Gavrilov
National Research University of Electronic Technology, Russia, 124498, Moscow, Zelenograd, Shokin sq., 1

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